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100MHz to 2500MHz, 45dB RF Detector
in a UCSP
fier of interest. This requires full consideration of the
intricacies of the PA detector control function. The
worst-case condition, where the PA output is smallest
(gain function is steepest), should be used because the
PA control function is nonlinear. An additional zero can
be added to improve loop dynamics by placing a resis-
tor in series with C CLPF .
Waveform Considerations
Although the input level of the MAX4003 is specified in
dBm, the logarithmic amplifier actually responds to rec-
tified voltage signals rather than a true RMS power. It is
important to realize that input signals with identical root-
mean-square power but with unique waveforms result
in different logarithmic outputs.
Differing signal waveforms result in either an upward or
downward shift in the logarithmic intercept. However,
the logarithmic slope remains the same.
Layout Considerations
As with any RF circuit, the MAX4003 circuit layout
affects performance. To ensure maximum power trans-
fer between 50 ? sources and the MAX4003 input, suit-
able matching networks should be implemented. The
V CC input should be bypassed as close as possible to
UCSP Reliability
The UCSP represents a unique package that greatly
reduces board space compared to other packages.
UCSP reliability is integrally linked to the user’s assem-
bly methods, circuit board material, and usage environ-
ment. The user should closely review these areas when
considering use of a UCSP. This form factor may not
perform equally to a packaged product through tradi-
tional mechanical reliability tests. Performance through
operating life test and moisture resistance remains
uncompromised as it is primarily determined by the
wafer fabrication process. Mechanical stress perfor-
mance is a greater consideration for a UCSP. UCSP
solder joint contact integrity must be considered since
the package is attached through direct solder contact
to the user’s PC board. Testing done to characterize
the UCSP reliability performance shows that it can per-
form reliably through environmental stresses. Results of
environmental stress tests and additional usage data
and recommendations are detailed in the UCSP
application note found on Maxim ’s website,
www.maxim-ic.com.
the device with multiple vias connecting the capacitor
to the ground plane.
Pin Configurations (continued)
TOP VIEW
8 V CC
RFIN 1
7 OUT
SHDN 2
TRANSISTOR COUNT: 358
Chip Information
GND
3
MAX4003
6
N.C.
CLPF 4
THIN QFN
5 GND
_______________________________________________________________________________________
9
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